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Fonon Technology International has developed a new industrial method to split nanomaterials: Zero Width Laser Cutting Technology.

According to the company in Lake Mary, Fla., it uses a laser “to generate the subsurface forces greater than intermolecular connections.” The technology induces internal stress to produce a controlled separation, Fonon said.

Since there is no debris generated during cutting, ZWLCT works in a clean room.

Fonon, near Orlando, makes standard marking, engraving and cutting carbon dioxide and fiber laser devices.